| Summary: | 碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === This study is aimed at how the AGV(automatic guided vehicle, AGV) system and RFID(radio frequency identification, RFID) system technologies are applied to laser cutting machines and washing cutting machines, transfer the dispatch message to the MCS(Material Control System, MCS) and the AGV system through the RTD(Real Time Dispatcher, RTD),then AGV system dispatched automated guided vehicle to pick up the goods or release the goods, Place the wafer carrier pod on the Load Port of the AS/RS(Automated Storage/Retrieval System, AS/RS) through the AGV, The RFID system reads the wafer carrier pod data and uploads the data to the material transfer control system, The robotic arm transports the 8 inch and 12 inch wafer carrier pods to the designated electronic rack location, the MCS dispatched the AGV to send the wafer carrier wafer cassette to the designated laser cutting machine and the washing and cutting machine, the wafer carrier pod is taken by the robot on the AGV and sent to the loader of the machine to start the production, This study proposes a conceptual architecture for the automation setup and operation of semiconductor packaging plants throughout the project implementation process, successfully made factory automation operations smarter and more efficient.
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