The Influence of Ground Plane Design Adjacent to Ball Pad on Signal Integrity
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === With the rapid development of semiconductor manufacturing technology, the required frequencies of electronic devices has been developed for higher frequencies and higher transmission rates. With the switching time getting shorter, the speed of IC...
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| Format: | Others |
| Language: | zh-TW |
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2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fee7k7 |
| Summary: | 碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === With the rapid development of semiconductor manufacturing technology, the required frequencies of electronic devices has been developed for higher frequencies and higher transmission rates. With the switching time getting shorter, the speed of IC package substrate circuits is increasing, and the electrical characteristics of the substrate is more critical. Along the path of circuit transmission, the signal will pass through a structure with discontinuous impedance that will cause signal reflection and resulting in distortion of the signal. This thesis will focus on the study of the substrate of a 5G mobile communication system with the signal frequency at 28 GHz, the data rate of 28 Gbps. The numerical model is based on a 100 ohm micro-strip differential transmission line. It shows that the ground plane area design and the distances between signal pads of the adjacent ball pad is critical to the performance of the electrical integrity of the substrate.
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