| Summary: | 碩士 === 國立臺灣科技大學 === 機械工程系 === 106 === This paper mainly studies how to make self-made conductive adhesive with good electromagnetic shielding ability. With the rapid development of technology, various types of communication facilities, electronic devices, and electronic products are widely used, and these electronic products generate electromagnetic waves that affect electronic components and human health. Therefore, there is a need for a mask that can eliminate or reduce electromagnetic waves. Materials, while the traditional types of masking materials are mostly pure metals, but metal materials are mostly bulky, difficult to process, and poorly bonded, so composite masking materials are produced, and conductive adhesives are good composite masking materials. In this study, three different epoxy resins were combined with metal powders, and different proportions of metal powders were added with different colloids. Among them, sliver micron-sized powder/sheet/wire and aluminum powder was added to the silicone resin. Powder, and blended with surfactants, solvents, decane coupling agents, etc., in order to find the most suitable formula. The experimental results show that the metal particles must reach 70wt% content, and the appropriate solvent is added to make the metal particles form a good conductive path in the gel body. Finally, the excess solvent is discharged by means of pressurized air filtration to produce a commercial type. The conductive adhesive of shielding ability has a resistance value is 24.8 Ω and an EMI shielding capability is -70 to -90 dB within 0.01~20 GHz.
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