Development of an Optical Inspection System Used for Measuring Dimension of Bonded Microfluidic Chips

• Main Authors: CHU FA-HSUAN, 朱法軒
• Other Authors: PIN-CHUAN CHEN
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/6wuvc6

碩士 === 國立臺灣科技大學 === 機械工程系 === 106 === This study aims to develop an automated optical inspection system for measuring microchannel dimension. Research about microfluidic chip has flourished in recent years. There will be more and more related products which are important for dimension appearing. Therefore we developed a non-destructive and non-contact measurement for bonded microfluidic chip to verify whether the microchannel dimension meets the tolerance specification. The data measured with measurement system we’ve developed is compared with the reference value measured with toolmaker microscope. The error obtained after comparing reaches ± 2 %.