Research on Predictive Analysis for SMT Production Yield Rate

碩士 === 國立臺灣科技大學 === 科技管理所 === 106 === This research which use production and inspection data from SMT chip mounter and AOI to established predictive analysis feasibility of SMT production line by way of big data analysis concept, data comparison and model set up. This purpose is to prevent the big r...

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Bibliographic Details
Main Authors: Kuo-Hua Ma, 馬國華
Other Authors: Shuo-Yan Chou
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/k75ggn
Description
Summary:碩士 === 國立臺灣科技大學 === 科技管理所 === 106 === This research which use production and inspection data from SMT chip mounter and AOI to established predictive analysis feasibility of SMT production line by way of big data analysis concept, data comparison and model set up. This purpose is to prevent the big reject rate and big defect rate rises up, which means operators / engineers can follow the work instructions base on predictive analytics to do process before high reject rate or defect rate occurred. To reduce components unusual loss and defect product output but the minimum downtime impact. In this research, we find out the correspondence between individual output such as Cycle Time, Error Code, Error quantity, feeder and nozzle. Combining process experience to create more elaborate individual model based on the process fishbone diagram to predict a large number of component losses to occur and precaution which operators have preventive treatment for reducing unnecessary component loss and waste. Likewise, by way of bad image by AOI inspected and manual re-checked. Defect condition can be systematically clarified by Reference . Combining the chip mounter data use as the same model establishment and analysis to filter the defect condition. The individual association ratio between chip mounter and printer, and then proceed with the steps and sequence of preventive treatment to reduce the defect but minimum impact on production hours. This research abstract the relative data of chip mounter and AOI, which total amount are 519pcs of single production order. Submitted the predictive analysis of component shift, poor solder and reject rate. SMT common anomalies are such as tombstone, chip side up and component missing..etc. It belongs to the single event in this batch order. But it can realize the predictive analysis with the same way via the research methods of component shift, poor solder and reject rate. The following up results will be imported practices by way through this research. Owing to I work for this company Ascentex which is an agent of SMT production equipment and also have after service. It has been almost 30 years in SMT field . In addition to we have automation system integration department with software programmer section. It is our responsibility which bring highly automated SMT field to Industry 4.0. I am looking forward to enhancing industrial competitiveness for SMT Taiwan merchants to force the pressure of The Red Supply Chain. And it also increases the additional value for the future sales of Ascentex.