Using decision tree and long short-term memory recurrent neural networks to assist in the adjustment parameters of die/wire bonding and quality prediction
碩士 === 國立臺灣科技大學 === 工業管理系 === 106 === During the assembly process of LED components, die bonding and wire bonding are the key factors affecting the defective rate. When the die bonding and wire bonding machine work, the engineers will adjust the parameters based on their experience. Meanwhile, the e...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u4q3y4 |