Packing Density and Sintering Characteristic of Copper Nanoparticle

Packing Density and Sintering Characteristic of Copper Nanoparticle

碩士 === 國立臺灣大學 === 化學工程學研究所 === 106 === In this thesis, we aimed to improve the packing density of copper nanoparticles and prepare copper films with compact structure by intense pulsed light (IPL) sintering. Copper has advantages of low cost and high electromigration resistance and it is a promising...

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Bibliographic Details
Main Authors:	Wan-Yu Chung, 鐘婉瑜
Other Authors:	Ying-Chih Liao
Format:	Others
Language:	zh-TW
Published:	2018
Online Access:	http://ndltd.ncl.edu.tw/handle/33vfaw

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