Packing Density and Sintering Characteristic of Copper Nanoparticle

• Main Authors: Wan-Yu Chung, 鐘婉瑜
• Other Authors: Ying-Chih Liao
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/33vfaw

碩士 === 國立臺灣大學 === 化學工程學研究所 === 106 === In this thesis, we aimed to improve the packing density of copper nanoparticles and prepare copper films with compact structure by intense pulsed light (IPL) sintering. Copper has advantages of low cost and high electromigration resistance and it is a promising material to replace silver as conductive ink filler. However, copper is rarely used due to the problems of fast oxidation and high sintering temperature. To improve the sintering characteristic of copper nanoparticles, we try to synthesize small cuprous oxide (Cu2O) particles on the surface of copper nanoparticles of 200nm. The cupric oxide particles can fuse easily to form connection between large copper particles. With the presence of reductant, conductive copper film is sintered and reduced simultaneously by IPL. To fill in the voids between Cu nanoparticles in the copper film, cupric oxide (CuO) nanoparticles of 50 nm are added into ink to increase packing density. Moreover, the light absorption is improved. The effect of the Cu/CuO weight ratio on sintering is also discussed. The copper film shows conductivity as low as 25% of bulk copper under optimum condition with sintering energy at 3.08J/cm2. This sintering strategy enables copper nanomaterials to show considerable potential for flexible electronics.