Seismic Evaluation of lithography packaging machine

• Main Authors: Huang,Da-You, 黃大祐
• Other Authors: Kuo,Keng-Chang
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/bhegqu

碩士 === 國立高雄第一科技大學 === 營建工程系碩士班 === 106 === The threats and potential risks posed by the earthquake to the high-tech industry in Taiwan have also attracted attention in recent years. As a result, equipment damage has caused the production line to stall, which will cause direct and indirect losses. This study takes the lithography packaging machine of southern Taiwan science park as the research object, First analyze the damage during the 2016 Mino earthquake and review the reinforcement design; further analyze the on-site micro-vibration measurement to confirm the dynamic characteristics of the machine as a reference for subsequent structural numerical analysis.With the structural analysis software SAP2000, the model of the machine and the reinforcing elements was established for modal analysis. After that,the dynamic duration analysis was performed and the acceleration duration data of the Jiaxian earthquake and the Mino earthquake were input respectively. Through the analysis results, whether the overall stiffness of the system was increased was checked to enhance the seismic resistance of the machine.