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碩士 === 國立中央大學 === 機械工程學系在職專班 === 106 === Light emitting diode （LED） technology and the pursuit of thin thickness and light weight, the chip scale package （CSP） LED is currently the focus of development. In order to reduce the package size and maintain the original function, the CSP LED has developed...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55wqg6 |