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• Main Authors: Chen-mengChuang, 莊振孟
• Other Authors: 陳奇夆
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/55wqg6

碩士 === 國立中央大學 === 機械工程學系在職專班 === 106 === Light emitting diode （LED） technology and the pursuit of thin thickness and light weight, the chip scale package （CSP） LED is currently the focus of development. In order to reduce the package size and maintain the original function, the CSP LED has developed a process of using a flip chip for light-emitting diodes. At present, the most commonly used process is a fluorescent film type. The fluorescent sheet is made of silicone and a high-density Flip chip, and cutting is completed after the baking is completed. In the LED CSP process, the industry is currently mainly engaged in fluorescent film. In this paper, the improvement is based on the current Flip chip production level reliability of 76 to 80% （product specification is center value 78%, lower limit value 75%）, Taguchi Genota's Taguchi is used. Methods: Through the orthogonal tables and related literature, three key reliability factors, such as tool pressure, tool sharpness, and cutting platform temperature, were identified. They were analyzed using the Taguchi method in an organized manner and finally relied on in the industry for reliability. The Reliability Analysis （RA） condition confirms the final result. The best combination obtained by this study is: tool pressure 0.5Mpa, tool sharpness 17°, cutting platform temperature 130°C. The experimental results show that the reliability is improved by 3% compared with the original cutting method, and the reliability is also from the current 80% of volume production increased to 83%.