Summary: | 碩士 === 國立交通大學 === 理學院應用科技學程 === 106 === Semiconductor manufacturing and application is an important research area in both academic and industrial field nowadays, and there are many ways to manufacture semiconductor materials. Most companies that have semiconductor business invest amounts of capitals and equipments to meet the “Moore’s Law”. There is one basic process for the semiconductor field that we call “Chemical Mechanical Polishing, CMP”; another way to describe it is “Wafer Polishing”. This process is applied to the removal of the dielectric layer oxide and the metal film by using the grinding slurry with abrasive and corrosive properties. Moreover, with a polishing pad and a support ring to provide planarization of the wafer surface, the roughness of the surface can be decreased during the polishing process.
The different sizes of particles in CMP slurry may cause wafer breaking or chip scratching in the process. Therefore, it is critical to use suitable filation membranes to control the particle sizes in CMP slurry. In my research, I focus on the effect and impact of fiber filtration materials. I design experiments based on the membrane filtration using commercial technology. Polypropylene (PP) fibers are prepared using the melt blown technique, and polystyrene latex is used as the impurity material. By changing different processing parameters such as the pump rate, nozzle size, and distance, PP fibers with different sizes and morphologies are prepared. Filtration membranes are constructed using different combinations of PP fibers. The filtration efficiencies are also measured under diffenent pH values and water temperatures.
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