Thermal Stress Analysis of Electronic Components under Temperature Cycling Test

• Main Authors: Liu, Ting-Kai, 劉庭凱
• Other Authors: Jang, Wen-Yea
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/g64ufa

碩士 === 國立交通大學 === 機械工程系所 === 106 === Nowadays, electronic components are widely used in a variety of systems in automobile. In automobile systems, most electronic components are often working in harsh environments with temperatures ranging from -40 °C to 155 °C. As a consequence, thermal stresses resulted from the difference of coefficients of thermal expansion in different component materials are usually responsible for mechanical failure of the electronic components. 　　In the present study, the finite element software ABAQUS was employed to establish the three-dimensional numerical model for thermal stress analysis of electronic components, based on the experimental conditions of the temperature cycling test. The numerical results revealed that the maximum stress occurred at the temperature 150 °C, located at edge of semiconductor wafer which agrees experimental observations. Such an agreement in turn verifies the validity of the numerical simulations. Parametric studies were subsequently conducted in an effort to offer the improvement strategy on the design of the electronic components. The effect of each of the parameters such as the size and thickness of the semiconductor wafer, the thickness of heat sink and package on the thermal stress was addressed accordingly. It was found that among the foregoing parameters reducing the size and thickness of the semiconductor wafer can effectively diminish the thermal stress induced in the temperature cycling test.