The Effect of Hydrogen Concentration on NAND Flash Memory Reliability

碩士 === 國立交通大學 === 電機工程學系 === 106 === In this thesis, we investigate the reliability of two different hydrogen concentration processes. The impacts of hydrogen concentration on interface state density and VT shifts after bake are studied by comparing two different hydrogen concentration. Higher hydro...

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Main Authors: Yang,Jhih-Siang, 楊智翔
Other Authors: Riichiro Shirota
Format: Others
Language:en_US
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/k44gna
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spelling ndltd-TW-106NCTU54420042019-05-16T00:08:11Z http://ndltd.ncl.edu.tw/handle/k44gna The Effect of Hydrogen Concentration on NAND Flash Memory Reliability 探討快閃記憶體元件製程中氫氣濃度對可靠度特性影響分析之研究 Yang,Jhih-Siang 楊智翔 碩士 國立交通大學 電機工程學系 106 In this thesis, we investigate the reliability of two different hydrogen concentration processes. The impacts of hydrogen concentration on interface state density and VT shifts after bake are studied by comparing two different hydrogen concentration. Higher hydrogen concentration provides more hydrogen molecular and hydrogen atoms to passivate the interface states at Si/SiO2 interface. The interface state density can be reduced around 15.5% in long interval by increasing hydrogen concentration from 4% to 100%. In our measurements, higher hydrogen concentration shows better reliability than lower hydrogen concentration. Moreover longer interval during cycling shows worse transconductance (Gm) and subthreshold swing (SS) degradation in both processes. In retention test, large interface states density would degrade the interval dependence of VT shifts after bake especially in lower hydrogen concentration. Riichiro Shirota 白田理一郎 2017 學位論文 ; thesis 26 en_US
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language en_US
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description 碩士 === 國立交通大學 === 電機工程學系 === 106 === In this thesis, we investigate the reliability of two different hydrogen concentration processes. The impacts of hydrogen concentration on interface state density and VT shifts after bake are studied by comparing two different hydrogen concentration. Higher hydrogen concentration provides more hydrogen molecular and hydrogen atoms to passivate the interface states at Si/SiO2 interface. The interface state density can be reduced around 15.5% in long interval by increasing hydrogen concentration from 4% to 100%. In our measurements, higher hydrogen concentration shows better reliability than lower hydrogen concentration. Moreover longer interval during cycling shows worse transconductance (Gm) and subthreshold swing (SS) degradation in both processes. In retention test, large interface states density would degrade the interval dependence of VT shifts after bake especially in lower hydrogen concentration.
author2 Riichiro Shirota
author_facet Riichiro Shirota
Yang,Jhih-Siang
楊智翔
author Yang,Jhih-Siang
楊智翔
spellingShingle Yang,Jhih-Siang
楊智翔
The Effect of Hydrogen Concentration on NAND Flash Memory Reliability
author_sort Yang,Jhih-Siang
title The Effect of Hydrogen Concentration on NAND Flash Memory Reliability
title_short The Effect of Hydrogen Concentration on NAND Flash Memory Reliability
title_full The Effect of Hydrogen Concentration on NAND Flash Memory Reliability
title_fullStr The Effect of Hydrogen Concentration on NAND Flash Memory Reliability
title_full_unstemmed The Effect of Hydrogen Concentration on NAND Flash Memory Reliability
title_sort effect of hydrogen concentration on nand flash memory reliability
publishDate 2017
url http://ndltd.ncl.edu.tw/handle/k44gna
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