| Summary: | 碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 106 === Most of the modern assembly factories acquire wafer ICs and parts, and then assemble and send back to customers after affixing product trademarks. The key advantages in a packaging company are the rapid turnover of operations, low cost, efficiency, and maintaining a strategic partnership with upstream suppliers and distributors. The electronics manufacturing services (EMS) is facing high inventory losses due to lumpy demand. In addition to decision-making and execution, financial operations, and price judgments, it is more important to minimize inventory level to meet customer needs at the right time rather than techniques. This study is applying aggregation of TOC to reduce the cumulative representation of uncertainty. The analysis is conducted by considering the common components. The current practice is a forecast-based and relying on safety stock which ensures a given level of service, dynamic buffer management tool dynamically adjusts the size of each material buffer and provides replenishment priorities by monitoring the status of the buffer. We propose a reliable inventory model applied to IC assembly industry. The model has been confirmed that uses the dynamic buffer management as a management tool for raw material can significantly improve the efficiency in warehouses. This study does not negate the demand forecasting for NPI stage as the introduction of new products is still in the experimental stage.
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