On the Thermal Performance of a Thermally Enhanced FC-PBGA Assembly
碩士 === 國立成功大學 === 機械工程學系 === 106 === On the Thermal Performance of a Thermally Enhanced FC-PBGA Assembly Jie Yu You Jun-Huang Wu Department of Mechanical Engineering of National Cheng Kung University SUMMARY In this thesis, the three-dimensional finite element analysis using the commercial ANSYS sof...
Main Authors: | Jie-YuYou, 游傑宇 |
---|---|
Other Authors: | Jun-Huang Wu |
Format: | Others |
Language: | zh-TW |
Published: |
2018
|
Online Access: | http://ndltd.ncl.edu.tw/handle/43xwnq |
Similar Items
-
Parametric Anaysis of FC-PBGA Thermal Performance
by: Jen-HuiChao, et al.
Published: (2017) -
Effect of solder-ball pitch on the reliability of a thermally enhanced FC-PBGA assembly
by: Ping-ChunShih, et al.
Published: (2014) -
Investigation of Thermal-Induced Warpage of PBGA and Its Assembly
by: Yu-Chen Chen, et al.
Published: (2006) -
Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
by: Zhi-Cheng-Huang, et al.
Published: (2015) -
Investigation of the Reliability in Thermally Enhanced Flip Chip PBGA Packages
by: Tien-PeiLiu, et al.
Published: (2011)