Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications

Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications

碩士 === 國立成功大學 === 電機工程學系碩士在職專班 === 106

Bibliographic Details
Main Authors:	Hsiang-MingHuang, 黃祥銘
Other Authors:	Yeong-Her Wang
Format:	Others
Language:	zh-TW
Published:	2018
Online Access:	http://ndltd.ncl.edu.tw/handle/b9k38w

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