Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications

碩士 === 國立成功大學 === 電機工程學系碩士在職專班 === 106

Bibliographic Details
Main Authors: Hsiang-MingHuang, 黃祥銘
Other Authors: Yeong-Her Wang
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/b9k38w
id ndltd-TW-106NCKU5442016
record_format oai_dc
spelling ndltd-TW-106NCKU54420162019-05-16T00:30:06Z http://ndltd.ncl.edu.tw/handle/b9k38w Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications 柱狀金凸塊具高速高頻於記憶體封裝之研製 Hsiang-MingHuang 黃祥銘 碩士 國立成功大學 電機工程學系碩士在職專班 106 Yeong-Her Wang 王永和 2018 學位論文 ; thesis 98 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 電機工程學系碩士在職專班 === 106
author2 Yeong-Her Wang
author_facet Yeong-Her Wang
Hsiang-MingHuang
黃祥銘
author Hsiang-MingHuang
黃祥銘
spellingShingle Hsiang-MingHuang
黃祥銘
Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications
author_sort Hsiang-MingHuang
title Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications
title_short Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications
title_full Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications
title_fullStr Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications
title_full_unstemmed Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications
title_sort gold stud bump with high speed and high frequencyfor dram package applications
publishDate 2018
url http://ndltd.ncl.edu.tw/handle/b9k38w
work_keys_str_mv AT hsiangminghuang goldstudbumpwithhighspeedandhighfrequencyfordrampackageapplications
AT huángxiángmíng goldstudbumpwithhighspeedandhighfrequencyfordrampackageapplications
AT hsiangminghuang zhùzhuàngjīntūkuàijùgāosùgāopínyújìyìtǐfēngzhuāngzhīyánzhì
AT huángxiángmíng zhùzhuàngjīntūkuàijùgāosùgāopínyújìyìtǐfēngzhuāngzhīyánzhì
_version_ 1719166535096860672