Gold Stud Bump with High Speed and High Frequencyfor DRAM Package Applications

• Main Authors: Hsiang-MingHuang, 黃祥銘
• Other Authors: Yeong-Her Wang
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/b9k38w

碩士 === 國立成功大學 === 電機工程學系碩士在職專班 === 106