Microstructural Effect of Electrodeposited Copper on Direct Bonding for Microelectronic Assembly
碩士 === 國立中興大學 === 材料科學與工程學系所 === 106 === In order to allow conductance between stacked ICs, jointing by metallic connections is necessary. Cu-to-Cu direct bonding is ideal to form required interconnections because copper possesses many advantages, e.g., excellent electrical conductivity, low cost an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8nze68 |