Using Reduced Graphene Oxide (rGO) as a Conducting Layer for PCB Metallization
碩士 === 國立中興大學 === 化學工程學系所 === 106 === Electroless (ELS) copper plating process has been commonly used in the PCB metallization, because the sidewalls of the through holes (THs) and microvias of PCBs are composited of resin and glass fiber, which are not conductive materials. Therefore, before copper...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2018
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Online Access: | http://ndltd.ncl.edu.tw/handle/nkk3ve |