Fine tuning of electroplating recipe to reach effective inhibition of impurity incorporation in Cu plated layer and voids at Sn/Cu interface
博士 === 國立中興大學 === 化學工程學系所 === 106 === In development process of electronic products, from the size trend smaller and lighter transfer to become higher and multiple performances progressively. The key technique of smaller width and higher density in circuit and the 3-dimensional HDI (high density int...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pq75ts |