Study on Surface Treatment by Atmospheric Pressure Plasma on BGA of FPC to Improve Electroplating Ability

• Main Authors: WU, YING-CHE, 吳穎哲
• Other Authors: YANG, WEIN-DUO
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/e6f3jg

碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 106 === Ball grid array, BGA, for load integrated circuit is common pattern design in FPC. There are the skip plating issue and the appearance abnormal after plating, because the BGA aperture diameter is small than 0.3 mm or unclean on copper surface. In this study, we use atmospheric pressure plasma for surface treatment with increasing the hydrophilic before plating. We compare to transmission rate, different of mixed gas ratio and gas flow to find the optimization of parameter, that affect the contact angle of BGA aperture. In addition, we evaluated to reliability and other derivative abnormal the from products test, that have same result of the reject rate after treatment by plasma. The results show that there is a best contact angle with the gas flow 150~180 L/min. In order to the cost of production, the optimized parameter is use nitrogen gas 150 L/min and transmission rate 2.2 m/min. Afterwards, we test to BGA-TEG boards and observed the skip plating reject rate after treatment by plasma. It is shown that the increased of the contact angle after 48 hours on the surface of copper and PI. And reject rate is 0 % below contact angle at 40°. Finally, we test to products of BGA aperture diameter 0.3 mm and batch produce. The reject rate is 40 % before plasma treatment, and decrease to 0 % after plasma treatment. All of the sample is regular and without other derivative abnormal with check the reliability. So we verify the atmospheric pressure plasma can application and improved the plating ability on BGA of FPC.