Improving Warpage of Duble-Sided Substrate Based on System in Package
碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === Popularity and volume requirements of modern electronic goods has become increasingly smaller,which is desirable in substrate to save more space,and more defined features can be increased in the restricted-size substrate,The direction of the current study is t...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/msw74a |