| Summary: | 碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === At first, the study proposes to change electron transport layer (TPBi) thickness and then used the indium tin oxide (ITO) glass substrate by oxygen plasma bombardment at different times. And then receive the best characteristics of the organic light-emitting diode (OLED) by TPBi thickness is 20 nm and the ITO glass substrate to oxygen plasma bombardment at 3 min. In packaging process using the three different packaging materials include UV resin, thermosetting adhesives and glass frit. The component used the continuous wave ultraviolet light and laser (CW laser) to packaging. Improve the OLED component lifetime and reliability with this hermetically sealed. Final, we can be seen that the components of glass frit packaged are the best of lifetime and reliability than UV resin and thermosetting adhesives.
At first proposes, the electron transport layer (TPBi) is discussed of 10 nm / 15 nm / 20 nm / 30 nm / 40 nm thickness. At the TPBi thickness is 20 nm had the best characteristic. The components obtained a maximum luminance of 21414 cd/m2 at the current density of 2190 mA/cm2, external quantum efficiency (EQE) of 1.39 %, current efficiency (CE) of 4.17 cd/A and power efficiency (PE) of 3.07 lm/W, respectively. At second, we used the best characteristics of the structure to do the main structure and pretreat the ITO glass substrate. We used the indium tin oxide (ITO) glass substrate to oxygen plasma bombardment at 2 minutes / 3 minutes / 4 minutes / 5 minutes / 8 minutes / 10 minutes. The oxygen plasma bombardment at 3 minutes had the best characteristic. The components obtained a maximum luminance of 25849 cd/m2 at current density of 1242 mA/cm2, and luminance efficiency enhanced by 17.2 %, external quantum efficiency (EQE) of 2.28 %, current efficiency (CE) of 7.20 cd/A and power efficiency (PE) of 5.28 lm/W, respectively. The efficiency enhanced by EQE 0.89 % / CE 42.1 % / PE 41.9 %, respectively. At the International Commission on Illumination (CIE) of chromaticity coordinates was 0.32, 0.54. The OLED component was green light at 532 nm wavelength.
Finally, the hermetic sealing of the OLED component was performed. The luminance only lost 0.2% after the OLED component hermetic packaged. The OLED component was measured by NI PXI-1033 and it will be set the initial luminance to 1000 cd/m2. The measured values are substituted into the stretched exponential decay (SED) to calculate the lifetime. The best lifetime and reliability result was used the glass frit to hermetic packaged that lifetime can achieve 1026 days. In the reliability result, the shear strength to hermetic packaged can be 16 kgf strength. In the leakage test, the best measured leakage was 8.9×10-9 atm*cc/s. The reliability parts were compliant with MIL-STD-883. This hermetic package technology has provided a barrier to prevent external water vapor and oxygen enter to the OLED component. Therefore, the hermetic package can enhance OLED component lifetime and reliability.
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