Reliability of GaN-Based LEDs Affected by Die-Attach Adhesive at Different Precuring Temperatures Before Die Bonding Process
碩士 === 崑山科技大學 === 光電工程研究所 === 106 === Reliability of 460 nm GaN-Based LEDs with dominant wavelength affected by before die bond at different precuring temperatures was studied in this thesis. We have compared two combinations: Combination A horizontal LED die bonding on the ceramic leadframes, u...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98hk5j |