The study of electrical characterization of 3D stacked TSV simulation
碩士 === 義守大學 === 電子工程學系 === 106 === 3D-IC Accompanied by rapid advances in the prediction of Moore''s Law, 3D-ICs offer a way to increase integration where Through-Silicon Via is a key component because TSV technology offers new The interconnection technology, plays a very important...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/qj4gjj |