Failure Modes and Effects Analysis through Association Rule Mining in Hyperconnected Manufacturing

碩士 === 義守大學 === 工業管理學系 === 106 === Hyperconnected Manufacturing has achieved connecting with customers, the goal is to transform “Production and sales separation” into “Production and marketing integration”, it can satisfy customer’s best experience from seamless, transparency and visualization. Ini...

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Bibliographic Details
Main Authors: Cheng-Huan Hsieh, 謝承桓
Other Authors: Siao-Gan Lin
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/3wv86v
Description
Summary:碩士 === 義守大學 === 工業管理學系 === 106 === Hyperconnected Manufacturing has achieved connecting with customers, the goal is to transform “Production and sales separation” into “Production and marketing integration”, it can satisfy customer’s best experience from seamless, transparency and visualization. Initiative shifts from producer to customer, from large-scale manufacturing to mass customization, from enterprise-centric to customer-centric, create effective demand, effective supply. How to improve the manufacturing quality, product yield and shorten the time-to-market of the product becomes extraordinarily important to the Hyperconnected Manufacturing. Therefore, the Hyperconnected Manufacturing regards quality as one of the core competitiveness, so it is absolutely necessary to use Failure Modes and Effects Analysis (FMEA) to improve the process. Through implementing FMEA, the company''s accumulated data is used to analyze the abnormal condition association rules of the products, and provide the company with a systematic, scientific and quantitative reference information. The company''s managers are able to surmise which part of the problem is caused by specific products and abnormal conditions, and propose improvement measures to prevent the failure from happening again, thereby improving the reliability of the product. Therefore, this study will be a semiconductor packaging and test manufacturing company for research and verification cases, the company provides a unified and customized service including semiconductor wafer front-end testing and wafer needle testing to the final stage of packaging, materials and finished product testing. The main products are: AS3, DOFU, Module, FCCSP, LBGA, PBGA, SD, WBGA, in this study, the eight production line data were put into the arules suite in R for Apriori algorithm for analysis. I hope to dig out valuable data from the database, find out the main conditions of each product anomaly and whether there are related rules for each abnormal situation. The main abnormal conditions and association rules of these 8 products are related to the research results section. However, in the FMEA, the risk level and the difficulty level are mainly determined by expert knowledge or experience. Therefore, the subsequent research hopes that the risk priority can be calculated faster and the complete FMEA can be made by the results of this study and the Intelligent Model.