A Study of Managerial Competency Training Map for Technical Engineer in IC Packaging Industry

• Main Authors: YANG,CHING-YI, 楊靜宜
• Other Authors: YANG,CHUN-CHI
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/jd2ps3

碩士 === 輔仁大學 === 企業管理學系管理學碩士班 === 106 === Taiwan semiconductor industry is one of the key industries promoted by the government, among which IC Packaging Industry lays a high competitive foundation because of the government's vigorously efforts to promote cooperation with enterprises. However, IC Packaging Industry is now facing rapid changes in the environment and of the market, thus, it is urgent for the government and enterprises to improve the ability of product innovation and the distribution of market strategy. Therefore, human resource development appears more important. This study mainly focuses on the last in the semiconductor industrial chain, IC Packaging Industry, which designs the training map based on the managerial competency required by the non-managerial and managerial staff in the field of IC Packaging Industry. It aims to help the enterprises to diagnose the core managerial competency, also to form the training program for promoting the managerial competency and reference for completing training courses. In addition, it aims to enable the employees of IC Packaging Industry to adapt to the changes and performs their managerial competency in the optimal way under the industrial changeable environment, to predict and assess managerial competency of talents for the post, and it can be used as the basis for talent identification. This study adopts the secondary data research method and the questionnaire survey method, it includes five parts: (1) Understanding the managerial competency of IC Packaging Industry employees; (2) Identifying the questionnaire of managerial competency; (3)Developing the description tables and course schedules of managerial competency of IC Packaging Industry employees; (4)Developing the training map of managerial competency of IC Packaging Industry employees; (5)Applying the training map practically to IC Packaging manufacturers. As a result, it is hoped that this study will contribute to the cultivation of talents in the semiconductor industry and to the development of human resources in Taiwan.