Optimal Design for Deformation of FCBGA Subjected to Hot Pressing by using Finite Element and Taguchi Methods
碩士 === 逢甲大學 === 機械與電腦輔助工程學系 === 106 === In recent years, the quality and yield have been improved dramatically because the package technology of Flip Chip Ball Grid Array (FCBGA) is developed very quickly. However, the specification requirements of the chip and the substrate are more rigorous. In ge...
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| Format: | Others |
| Language: | zh-TW |
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2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/qp8xd7 |