| Summary: | 碩士 === 逢甲大學 === 纖維與複合材料學系 === 106 === The purpose of this thesis is to study the characteristics of Ni-P plating process, to explore the different phosphorous acid content of Ni-P alloy through the Hull cell test, selecting two variables：changes in nickel and phosphorous acid concentrations were observed and compared. In this experiment, surface morphology obtained from scanning electron microscopy (SEM), the wt.% of phosphorus measured by the device of elemental analyzer (XRF) , and the contact angle was determined by the shape of a liquid droplet by the surface tension of the liquid through Drop Shape Analyzer, to investigate the influence of electroplating process on the coating. Finally, the micro-hardness of the coating obtained from the nano-indenter while the element content of phosphorus increased.
In this study, four groups of nickel-phosphorus alloy are discussed. The first one is to discuss the continuous change of microstructure of Ni-P alloy coating with the concentration of phosphorous acid and nickel. The second group calculates the concentration curve of nickel and phosphorous acid (H3PO3, phosphorus providers) which was adjusted for the curve changes between current density and these two factors. The third group measured the contact angle through observing the changes between medium-high phosphorus and high-concentration nickel. Finally, we discuss the hardness of nickel-phosphorus alloy to explore the increase of phosphorus to high phosphorus for hardness changes.
In this study, we can conclude that tin would diffuse better on the plating surface under the concentration of nickel and phosphorous acid, which is respective to 145 g/L and 4.5 g/L in IC packing process.
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