Analyses of the Wafer Probing Under the Circumstance of Temperature Variations for Augmenting the Overall Yield Rate
碩士 === 中原大學 === 電機工程研究所 === 106 === Under a thermal shock, not only is the characteristic curve of the semiconductor device sensitive to the temperature variations, but the setting of the wafer probing test accessories and the machine itself also has an impact onto the surrounding temperature, which...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/rkt969 |