Strength Test of Slender Die and Development of Glue Characteristic Parameters in Die Pick Up Process

• Main Authors: CHIH,JYUN-YING, 池俊穎
• Other Authors: Liu, De-Shin
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/wd3rcs

碩士 === 國立中正大學 === 機械工程系研究所 === 106 === According to the enhancement of LCD technique, the requirements of lighter, thinner, shorter, and smaller products have become a trend for the LCD industry. The typical driver IC, Chip On Film Packaging (COF), has to improve the design to meet the target of high performance with high I/O count. Compared with the traditional package, the die in COF needs to be designed as a slender shape with high slenderness ratio. It can be easily caused damage by the adhesive force between bonding UV type and die during die pick up process. Therefore, to investigate breaking strength of high slenderness ratio die, and analyze the die bond pick up parameters are very important research topics. In this research, we use Four Point Bending (4PB) test to measure the limited breaking force of slender shape die and use the technology of high speed camera to capture whole experimental process clearly, and satisfy the thickness die will not slip during the 4PB test. Moreover, finite element simulation model about 4PB was developed to obtain the breaking stresses for slender shape die as the design limit for pick up process. About adhesive test, the normal test and shear test will be setup to find the cohesive element parameter range, at last, use Tauguchi method to choose the value from the parameter range, use the die pick up experiment with high speed camera and simulation to find the correct cohesive parameter.