| Summary: | 碩士 === 國立臺北科技大學 === 機電整合研究所 === 105 === With the sophisticated semiconductor manufacturing technology, so that todays electronic components are getting smaller and smaller. While the results of precision, but also bring many adverse effects. Which electrostatic discharge (Electrostatic Discharge, ESD) is very influential, resulting in electronic components by electrostatic damage, poor quality, so the industry for ESD protection is also more and more attention.
In this study, PC + 8% CF material was explored in the injection molding process to optimize the process parameters to improve the material resistivity and enhance the tensile strength. By Taguchi experiment method, the best combination of process parameters was found with less sample number and for the melt temperature, mold temperature, injection speed and packing pressure in the control parameters. According to Taguchi analysis, the best parameters of surface resistivity can be obtained as A1B1C1D3, the best combination of tensile strength is A2B3C1D3, and the best parameter of the injection molding process with integrated resistivity and tensile strength is A1B1C2D3. According to the experimental results can be obtained by the process parameters to predict the conductivity and tensile strength of the method to reduce the time and cost of new product development process. The application of optimized process parameters can improve product durability, and reduce the risk of potential ESD.
|
|---|
