| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 105 === Bluetooth beacon device housing is composed of upper cover, bottom casing, and push button. The three components must be produced in the same set of family mold based on the mold cost. The volume of the push button component is much smaller than the other two parts. Hence, the push button will be the first fill completed in the injection process due to flow unbalance. This will cause the push button to over filling and affect the assembly of the entire bluetooth beacon device. In this study, Moldex3D software was used to analyze the flow condition of the device housing by changing the pin gate diameter of cold runner, and to improve the flow unbalance. Results show the degree of balance is only 69.7% when the pin gate diameters of the three cavities are all the same, i.e., 1.5 mm (large diameter) × 1.0 mm (small diameter). When the gate size of the push button cavity is from the original design change to 1.0 mm (large diameter) × 0.8 mm (diameter), the degree of balance can be significantly improved to 96.5%.
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