Development of light-curable resin with multi-functions：Water vapor barrier sealant of edge packaging, planarization of thin film coating, low shrinkage material for 3D printing

• Main Authors: Wen-Jie Yang, 楊文傑
• Other Authors: Kun-Li Wang
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/ekg5fm

碩士 === 國立臺北科技大學 === 化學工程研究所 === 105 === Part III：Development of light-curable resin with low shrinkage and its application in continuous liquid interface production (3D printing) The aim of this research is to develop a light-curable acrylic resin with low cure shrinkage. Herein, the formulas in use were followed by the sol-gel reaction mentioned in the first part. Disscussing the effects of changing double bond density on cure shrinkage, also the influence of thermal and mechanical properties by changing design of oligomer structure and the proportion of acrylate functional group. The result show the shrinkage value after curing is obviously declined by reducing the double bond density of the oligomer, and the lowest one is only 0.97% without filleradded. Moreover, the fluidity of resin presents a low temperature glutinous (51200 cps) and a high temperature flowing (1220 cps), which were respectively suitable for 3D molding technology in “Stereo Lithography Apparatus (SLA)” and “Digital Light Processing (DLP)” system. Then the cured material showed 5% and 10% weight loss temperatures under nitrogen at 347~377℃ and 382~411℃, respectively, and the highest tensile strength reaches 18.02 MPa. To sum up, these results suggest that photo-curable acrylic resin has the advantages of easy preparation, colorlessness, fast curing, high pyrolysis temperature and low cure shrinkage, and it should have a good performance in the high-precision 3D molding technology whether in use directly or as a modified agent for commercially available resin.