3D Profile Reconstruction and Measurement of Solder Ball with Shape from Focus

• Main Authors: GAUN YU KE, 柯冠宇
• Other Authors: Fang Chin Tien
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/m33fuh

碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 105 === Printed circuit board used in many kinds of electronic products as a control unit and the core. PCB mainly use solder as an important element of electronic components and circuit board connection. In the field of machine vision in two-dimensional detection of solder connections be too numerous to enumerate. Study on the 3D measurement and reconstruction but the height of the object shape is relatively few. Therefore, this paper adopts stepper motor drive mechanism with the machine vision, achieving the 3D profile reconstruction of the solder by Shape from Focus. In the last, to verify the repeatability and reproducibility of the system, used the Gage R&R analysis.