| Summary: | 碩士 === 南臺科技大學 === 化學工程與材枓工程系 === 105 === In this study, thermal debonding adhesives can be prepared using the adhesive, thermal expansion particles (TEPs), hardener (PN-175) and ethyl acetate (EAC) by solution blending, which can be used as a bonding agent for wafer process. The adhesive has excellent adhesive strength at room temperature, however when the temperature rises to a certain level, the adhesive effect reduced. It was followed by the strength test and the amount of residual rubber with regard to the different adhesive. There’re two topics in this study. In the first part, the commercial adhesives / TEPs composites were prepared, and the results showed that with 10phr TEPs of ethyl 2-cyanopropenoate (ECA) adhesives showed good adhesive property then they also can be debonded in this experiment. But the addition of TEPs will have a detrimental effect on the thermal stability decreases of the ethyl 2-cyanopropenoate (ECA) adhesive and the rapid cure rate of the ECA adhesive, which will cause inconvenience and adverse effects on the use of the adhesive. The second part is to prepare the pressure sensitive adhesives (PSA) / TEPs composites with different amount of TEPs. Four adherent substrates were tested by the PSA / TEPs composites. The thermal properties, surface morphology, adhesive strength and heat debonding strength and other characteristics of samples were examined. The results showed that when the TEPs were added to 10phr, the other three substrates were already required (> 500 gf / 25 mm) in addition to the silicon wafer substrate, and after 200oC heating conditions, the debonding force of PSA / TEPs composites was decreased with increasing the heating time, especially copper foil and silicon wafer parts, after heating 10 minutes can be achieved no adhesive residue, however the adherent substrate SUS 304 when the TEPs were added to 15phr, after heating for 15 minutes to achieve the minimum amount of adhesive residue, the adherent substrate glass including 15phr of the TEPs, after heating for 25 minutes can be achieved no adhesive residue. It can be seen that the thermal debonding adhesives are suitable for use in the 3C process temporary process.
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