| Summary: | 碩士 === 國立聯合大學 === 化學工程學系碩士班 === 105 === In this study, the new self-assembly method is applied to the commercial formula. At first stage as dipping, the use of copper electrolyte to change adsorption capability of the accelerator. It is expected that the accelerator promotes to reduction for copper ions in micro-via. At second stage as electroplating, the suppressor and leveler are expected to reduce the copper reduction rate on the cathode surface.Electrochemical analysis is investigated by cyclic linear sweep voltammetry, potentiostatic measurements and galvanostatic analyses.
The results of electrochemical analysis show that the reaction mechanism of new self-assembly method is different from the general commercial plating method. The new self-assembly method is to preferentially adsorb the accelerator, therefore, the accelerator promotes to reduce for copper ions in micro-via, contrary to the general commercial plating method. Adding copper ions in the first stage, which reduces the adsorption of the accelerator. As the copper ion concentration increases, the accelerator can be removed from the cathode surface.
The results of dies electroplating morphology analysis show that adding copper ions in the first stage, which can reduce the concentration of accelerator on the die surface. The distribution of accelerator on the die surface will be affected by changing the flow rate and flow direction in the first stage, even obtaining a different copper reduction deposition rate of the die surface and the microvia. High aspect ratio of the microvia have low surface thickness and microvia filling, to get a good RDT value(RDT≧10).
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