The Study of FC BGA Board Level Performance Improvement
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 105 === In this paper, the failure rate of BLRT (Board Level Reliability Test) is discussed and analyzed. In the analysis, we need to analyze the possible influence of different parameters of substrate, underfill, and solder ball materials. Shadow Moiré...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/srgx5q |