The Study of Liability of Palladium Coated Copper Wire Bonding due to the Distribution of Palladium
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 105 === Today, in view of the progressive of packaging technology, the anti-oxidation of palladium coated copper wire is fully applied to the wire bonding. However, during the reliability demonstration test, it was observed that the factor of connection...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e2x658 |