| Summary: | 碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 105 === Today, in view of the progressive of packaging technology, the anti-oxidation of palladium coated copper wire is fully applied to the wire bonding. However, during the reliability demonstration test, it was observed that the factor of connection to the welding point influenced by bonding wire conditions. The over-temperature of the bond wire causes the palladium incomplete cover on the welding point of copper wire by experiment; the exposed area is easily oxidized and results in failure with high-temperature and high-humidity. In this study, the elements on the welding point have discussed which under the different welding factors via Energy Dispersive X-ray Spectroscopy (EDS), Scanning Electron Microscope (SEM), and Electron Probe X-ray Micro-Analyzer (EPMA). Furthermore, the surface distribution of palladium could be improved through setting discharge parameters of bond wire, and confirmed the reliability of copper wire could be enhanced, even reducing failure rate in production.
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