Research on Dynamic Contact Reliability Analysis of Spring Probe under Current Load

• Main Authors: Chiu, Pang-Cheng, 邱邦誠
• Other Authors: Wu, Sung-Mao
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/01491952861788635804

碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === Most interfaces are using the spring probe to do chip or package testing that the major function is connecting the signal and power between DUT and ATE. The life time of the spring probe will most important performance but the life time specification of the spring probe is mechanical life not including voltage or current under the testing. In this paper will present a reliability analysis tester and process for the spring probe that will simulate the test process of chip and package test environment. Base on chip and package test conditions, design the solder ball substrate and feed the reliability analysis tester with voltage and current by power supply to do reliability analysis of the spring probe and keep observing the spring probe performance by number of tests. Further, using the failure to research high frequency performance and make a new calibration kit use on spring probe. The calibration kit is following the SOLT calibration method to design that is easier moving the calibration plan to spring probe tip. After calibration, use Front End Module to verify the calibration method.