The Study on the Application of Hybrid Loop Heat Pipe System in High Performance Notebook
碩士 === 國立臺灣大學 === 機械工程學研究所 === 105 === In recent years, due to the progress of semiconductor manufacturing process, electronic equipment goes toward high-density and high-performance goals. While the wafer size is minimizing, the unit area that contains the number of transistors is continuously incr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/986vr5 |