| Summary: | 碩士 === 國立臺灣大學 === 機械工程學研究所 === 105 === Nowadays, the PCB boards manufactured by conventional etching or ink-jet printing process are still widely applied in many commercial electronic devices. But the low resolution and less substrate variety of the conventional PCB technology limit its advanced applications in electronics/semiconductor industry. This study intends to use Aerosol Jet Printing (AJP) to additive-manufacture the PCB board with high compatibility and accuracy. In contrast to ink-jet printing and etching process, AJP process can use the most extensive ink materials and has a flexible application range, good resolution, low waste and low pollution and easy to develop, etc. Due to the good focusing ability by sheath gas technique, AJP can reach the resolution as three times higher than the inkjet technology, and avoid a large number of chemical waste and complex circuit graphics transfer steps generated with etching process. AJP technology has strong potential in electronics prototyping and other application fields.
In this study, we designed the PCB board for the LED control module suitable for the AJP method. By tuning ink/co-solvent properties and printing parameters, we successfully optimized the electricity to 14.5 times bulk silver and reliability of the printed metallic patterns.
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