Reliability Assessment of Wafer Level Package using Modified Energy Based Model

• Main Authors: Tsou, Cheng-Yen, 鄒承諺
• Other Authors: Chiang, Kuo-Ning
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/p4jyx2

碩士 === 國立清華大學 === 動力機械工程學系 === 105 === abstract hide