Application of Lean Six Sigma for Process Improvement - A Case Study of Wafer Acceptance Test

• Main Authors: Kuo, Hung-Tai, 郭宏泰
• Other Authors: Chen, James C.
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/u54ws4

碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 105 === abstract hide