| Summary: | 碩士 === 國立屏東科技大學 === 機械工程系所 === 105 === The technology nowadays has made rapid progress, the process of semiconductor packaging are changed rapidly which is caused by market requirement, of course, the semiconductor packaging plant is among them. However, every process has its own SOP (Standard Operation Procedure) which is very important to create high quality production for every company. With the rapid progress of technology and the exaltation of quality requirements, process must be innovated and improved constantly, because it immediately concerns the company competitiveness. The process is the core of manufacturing for every company because of having good process means that can deal with a mount of production and customized orders.
We’re researching laser engraving machine engraving 2D barcode in this study, the indirect materials in semiconductor packaging plant will become more and more which is caused by wafer foundry design. With the diverse productions and storage space of inventory, companies need to cost a lot money and manpower to maintain the original level of service. The 2D barcode system with combination of terminal database integration and automated barcode machine can reduce the management of materials and manpower consumption, and also enhance the production capacity greatly.
|
|---|
