Manufacturing flow time estimation: case study of IC back-end assembly

碩士 === 國立高雄第一科技大學 === 運籌管理系碩士班 === 105 === The manufacturing processes become more and more complicated nowadays such as semiconductor manufacturing. The materials and components used in the processes also increase and they would be different according to which product types are used. There a...

Full description

Bibliographic Details
Main Authors: CHEN, YU-WEI, 陳昱惟
Other Authors: GUO, SHIN-MING
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/fq7f72
id ndltd-TW-105NKIT0682016
record_format oai_dc
spelling ndltd-TW-105NKIT06820162019-05-15T23:32:16Z http://ndltd.ncl.edu.tw/handle/fq7f72 Manufacturing flow time estimation: case study of IC back-end assembly 製造流程時間之預測 - 以IC封裝廠為例 CHEN, YU-WEI 陳昱惟 碩士 國立高雄第一科技大學 運籌管理系碩士班 105 The manufacturing processes become more and more complicated nowadays such as semiconductor manufacturing. The materials and components used in the processes also increase and they would be different according to which product types are used. There are lots of materials need to take hours or even one day to defrost, the expired date is short and easily overdue. It is a big challenge for production line to decide when to thaw out the multiple materials. This study aims to develop the models for predicting the manufacturing flow time to suggest production line when to defrost the materials and avoid to waste too much materials. The regression tree approach is used and analyzed the historical data from an IC back-end assembly company. The target is to predict the manufacturing time to Molding stage when a product moves in to the assembly process. The model can directly predict the flow time from each stage to Molding stage, and there is also another model can forecast the flow time segmented. For example, when a product move into Rivet stage, the model can evaluate the process time from Rivet to Wire Bonding and Wire Bonding to Molding based on the process status at the moment. It can help not only Molding to prepare the material but also Wire Bonding stage. Finally, the research develops the different models for each stages, and the models estimate the manufacturing flow time according to work in process (WIP), machine numbers in each stage, order quantities and the slack time to due date. The forecast accuracy for predicting directly is similar to use the segmented models. The result shows after predicting the flow time to Molding in Rivet stage, when the product moves into next major stage, it should update the process status and re-predict the flow time, and it can improve the forecast accuracy. GUO, SHIN-MING 郭幸民 2017 學位論文 ; thesis 49 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立高雄第一科技大學 === 運籌管理系碩士班 === 105 === The manufacturing processes become more and more complicated nowadays such as semiconductor manufacturing. The materials and components used in the processes also increase and they would be different according to which product types are used. There are lots of materials need to take hours or even one day to defrost, the expired date is short and easily overdue. It is a big challenge for production line to decide when to thaw out the multiple materials. This study aims to develop the models for predicting the manufacturing flow time to suggest production line when to defrost the materials and avoid to waste too much materials. The regression tree approach is used and analyzed the historical data from an IC back-end assembly company. The target is to predict the manufacturing time to Molding stage when a product moves in to the assembly process. The model can directly predict the flow time from each stage to Molding stage, and there is also another model can forecast the flow time segmented. For example, when a product move into Rivet stage, the model can evaluate the process time from Rivet to Wire Bonding and Wire Bonding to Molding based on the process status at the moment. It can help not only Molding to prepare the material but also Wire Bonding stage. Finally, the research develops the different models for each stages, and the models estimate the manufacturing flow time according to work in process (WIP), machine numbers in each stage, order quantities and the slack time to due date. The forecast accuracy for predicting directly is similar to use the segmented models. The result shows after predicting the flow time to Molding in Rivet stage, when the product moves into next major stage, it should update the process status and re-predict the flow time, and it can improve the forecast accuracy.
author2 GUO, SHIN-MING
author_facet GUO, SHIN-MING
CHEN, YU-WEI
陳昱惟
author CHEN, YU-WEI
陳昱惟
spellingShingle CHEN, YU-WEI
陳昱惟
Manufacturing flow time estimation: case study of IC back-end assembly
author_sort CHEN, YU-WEI
title Manufacturing flow time estimation: case study of IC back-end assembly
title_short Manufacturing flow time estimation: case study of IC back-end assembly
title_full Manufacturing flow time estimation: case study of IC back-end assembly
title_fullStr Manufacturing flow time estimation: case study of IC back-end assembly
title_full_unstemmed Manufacturing flow time estimation: case study of IC back-end assembly
title_sort manufacturing flow time estimation: case study of ic back-end assembly
publishDate 2017
url http://ndltd.ncl.edu.tw/handle/fq7f72
work_keys_str_mv AT chenyuwei manufacturingflowtimeestimationcasestudyoficbackendassembly
AT chényùwéi manufacturingflowtimeestimationcasestudyoficbackendassembly
AT chenyuwei zhìzàoliúchéngshíjiānzhīyùcèyǐicfēngzhuāngchǎngwèilì
AT chényùwéi zhìzàoliúchéngshíjiānzhīyùcèyǐicfēngzhuāngchǎngwèilì
_version_ 1719148899933880320