| Summary: | 碩士 === 國立彰化師範大學 === 機電工程學系所 === 105 === Nowadays, the industry of micromechanical with outstanding advances in semiconductor process develops rapidly. Application of this new technology enables miniaturize products in nanometer, and at the same time, improves its performance, reliability and reduces the cost of manufacture. Among them, the research of thermal sensor is more and more complete, and the integration of sensing system and mechanical structure to a single chip is the research trend of micro-electromechanical industry.
In this study, the active thermoelectric element was fabricated using a TSMC 0.35μm 2P4M standard CMOS semiconductor process. In this paper, in order to make the thermopile effect of thermopile has a further breakthrough, this paper proposes a symmetrical thermopile of the ring array in the heater. In addition to increasing the number of thermocouples, this design can get a good temperature difference and the voltage difference.
Through the analysis of the characteristics measurement of the sensor, we can find the thermopile and heater both are positive resistance temperature coefficient. Through the pulsed heating to the heater different power, in the electrical measurement, the thermopile has a good electrical signal output, and the element of the heat conduction to 0.00433 (W/K), and the heat capacity is 0.0001.7 (J/K). In the thermal measurement, the minimum amount of noise is 1.59 mV. In the frequency response measurement, the cutoff frequency of the Thermopile at the frequency response (-3db) is 3.94 Hz.
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